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Architecting High-Performance Embedded Systems

You're reading from  Architecting High-Performance Embedded Systems

Product type Book
Published in Feb 2021
Publisher Packt
ISBN-13 9781789955965
Pages 376 pages
Edition 1st Edition
Languages
Author (1):
Jim Ledin Jim Ledin
Profile icon Jim Ledin

Table of Contents (15) Chapters

Preface Section 1: Fundamentals of High-Performance Embedded Systems
Chapter 1: Architecting High-Performance Embedded Systems Chapter 2: Sensing the World Chapter 3: Operating in Real Time Section 2: Designing and Constructing High-Performance Embedded Systems
Chapter 4: Developing Your First FPGA Program Chapter 5: Implementing systems with FPGAs Chapter 6: Designing Circuits with KiCad Chapter 7: Building High-Performance Digital Circuits Section 3: Implementing and Testing Real-Time Firmware
Chapter 8: Bringing Up the Board for the First Time Chapter 9: The Firmware Development Process Chapter 10: Testing and Debugging the Embedded System Other Books You May Enjoy

Post-assembly board cleaning and inspection

It is best to clean excess flux from the board shortly after soldering is complete. If the flux has an opportunity to dry out, it can be difficult or impossible to remove the residue.

If your solder paste is of the no-clean variety, you may choose not to remove the residue. No-clean solder paste leaves behind a limited quantity of flux residue, and this material is non-corrosive. It may be more difficult to remove the residue of this type of flux than to remove rosin flux.

Rosin flux should be cleaned from the board after soldering. This includes work done with rosin core solder wire and with liquid or pen-applied flux. The reasons why cleaning is necessary are as follows:

  • Flux residue is visually unappealing. Rosin flux residue is a clear, shiny material with a yellow color that users of the device will notice. Customers purchasing the product may raise concerns about the quality of construction if it is present.
  • The residue...
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